Doctor of Philosophy

dissertationIn recent years, a number of trends have started to emerge, both in microprocessor and application characteristics. As per Moore's law, the number of cores on chip will keep doubling every 18-24 months. International Technology Roadmap for Semiconductors (ITRS) reports that wires will continue to scale poorly, exacerbating the cost of on-chip communication. Cores will have to navigate an on-chip network to access data that may be scattered across many cache banks. The number of pins on the package, and hence available off-chip bandwidth, will at best increase at sublinear rate and at worst, stagnate. A number of disruptive memory technologies, e.g., phase change memory (PCM) have begun to emerge and will be integrated into the memory hierarchy sooner than later, leading to non-uniform memory access (NUMA) hierarchies. This will make the cost of accessing main memory even higher. In previous years, most of the focus has been on deciding the memory hierarchy level where data must be placed (L1 or L2 caches, main memory, disk, etc.). However, in modern and future generations, each level is getting bigger and its design is being subjected to a number of constraints (wire delays, power budget, etc.). It is becoming very important to make an intelligent decision about where data must be placed within a level. For example, in a large non-uniform access cache (NUCA), we must figure out the optimal bank. Similarly, in a multi-dual inline memory module (DIMM) non uniform memory access (NUMA) main memory, we must figure out the DIMM that is the optimal home for every data page. Studies have indicated that heterogeneous main memory hierarchies that incorporate multiple memory technologies are on the horizon. We must develop solutions for data management that take heterogeneity into account. For these memory organizations, we must again identify the appropriate home for data. In this dissertation, we attempt to verify the following thesis statement: "Can low-complexity hardware and OS mechanisms manage data placement within each memory hierarchy level to optimize metrics such as performance and/or throughput?" In this dissertation we argue for a hardware-software codesign approach to tackle the above mentioned problems at different levels of the memory hierarchy. The proposed methods utilize techniques like page coloring and shadow addresses and are able to handle a large number of problems ranging from managing wire-delays in large, shared NUCA caches to distributing shared capacity among different cores. We then examine data-placement issues in NUMA main memory for a many-core processor with a moderate number of on-chip memory controllers. Using codesign approaches, we achieve efficient data placement by modifying the operating system's (OS) page allocation algorithm for a wide variety of main memory architectures

Exploring the design space for 3D clustered architectures

Journal Article3D die-stacked chips are emerging as intriguing prospects for the future because of their ability to reduce on-chip wire delays and power consumption. However, they will likely cause an increase in chip operating temperature, which is already a major bottleneck in modern microprocessor design. We believe that 3D will provide the highest performance benefit for high-ILP cores, where wire delays for 2D designs can be substantial. A clustered microarchitecture is an example of a complexity-effective implementation of a high-ILP core. In this paper, we consider 3D organizations of a single-threaded clustered microarchitecture to understand how floorplanning impacts performance and temperature. We first show that delays between the data cache and ALUs are most critical to performance. We then present a novel 3D layout that provides the best balance between temperature and performance. The best-performing 3D layout has 12% higher performance than the best-performing 2D layout

Efficient scrub mechanisms for error-prone emerging memories

Journal ArticleMany memory cell technologies are being considered as possible replacements for DRAM and Flash technologies, both of which are nearing their scaling limits. While these new cells (PCM, STT-RAM, FeRAM, etc.) promise high density, better scaling, and non-volatility, they introduce new challenges. Solutions at the architecture level can help address some of these problems; e.g., prior re-search has proposed wear-leveling and hard error tolerance mechanisms to overcome the limited write endurance of PCM cells. In this paper, we focus on the soft error problem in PCM, a topic that has received little attention in the architecture community. Soft errors in DRAM memories are typically addressed by having SECDED support and a scrub mechanism. The scrub mechanism scans the memory looking for a single-bit error and corrects it be-fore the line experiences a second uncorrectable error. However, PCM (and other emerging memories) are prone to new sources of soft errors. In particular, multi-level cell (MLC) PCM devices will suffer from resistance drift, that increases the soft error rate and incurs high overheads for the scrub mechanism. This paper is the first to study the design of architectural scrub mechanisms, especially when tailored to the drift phenomenon in MLC PCM. Many of our solutions will also apply to other soft-error prone emerging memories. We first show that scrub overheads can be reduced with support for strong ECC codes and a lightweight error detection operation. We then design different scrub algorithms that can adaptively trade-off soft and hard errors. Using an approach that combines all proposed solutions, our scrub mechanism yields a 96.5% reduction in uncorrectable errors, a 24.4 × decrease in scrub-related writes, and a 37.8% reduction in scrub energy, relative to a basic scrub algorithm used in modern DRAM systems

Dynamic hardware-assisted software-controlled page placement to manage capacity allocation and sharing within large caches

Journal ArticleIn future multi-cores, large amounts of delay and power will be spent accessing data in large L2/L3 caches. It has been recently shown that OS-based page coloring allows a non-uniform cache architecture (NUCA) to provide low latencies and not be hindered by complex data search mechanisms. In this work, we extend that concept with mechanisms that dynamically move data within caches. The key innovation is the use of a shadow address space to allow hardware control of data placement in the L2 cache while being largely transparent to the user application and off-chip world. These mechanisms allow the hardware and OS to dynamically manage cache capacity per thread as well as optimize placement of data shared by multiple threads. We show an average IPC improvement of 10-20% for multiprogrammed workloads with capacity allocation policies and an average IPC improvement of 8% for multi-threaded workloads with policies for shared page placement

ABP : predictor based management of DRAM row buffers

posterDRAM accesses are costly, especially in multicore systems. Future CMPs will run a mixed load of workloads/threads. Destructive interference at memory controller, spatio-temporal locality lost! DRAM row-buffer hits are least expensive, row-conflicts are most. Randomized memory access patterns render traditional row-buffer management policies useless. Most commercial CMPs have no buffer management policies implemented [1]. Timer based policies [2,3] are too coarse-grained to be effective. Rather then time, focus on access patterns. Access patterns are predictable, a predictor can accurately predict the number of accesses for which the row-buffer be kept open. In any case, can't do worse than a static policy

Rethinking Design Metrics for Datacenter DRAM

Over the years, the evolution of DRAM has provided a little improvement in access latencies, but has been optimized to deliver greater peak bandwidths from the devices. The combined bandwidth in a contemporary multi-socket server system runs into hundreds of GB/s. However datacenter scale applications running on server platforms care largely about having access to a large pool of low-latency main memory (DRAM), and in the best case, are unable to utilize even a small fraction of the total memory bandwidth. In this extended abstract, we use measured data from the state-of-the-art servers running memory intensive datacenter workloads like Memcached to argue for main memory design to steer away from optimizing traditional metrics for DRAM design like peak bandwidth so as to be able to cater the growing needs to the datacenter server industry for high density, low latency memory with moderate bandwidth requirements

Understanding the impact of 3D stacked layouts on ILP

Journal Article3D die-stacked chips can alleviate the penalties imposed by long wires within micro-processor circuits. Many recent studies have attempted to partition each microprocessor structure across three dimensions to reduce their access times. In this paper, we implement each microprocessor structure on a single 2D die and leverage 3D to reduce the lengths of wires that communicate data between microprocessor structures within a single core. We begin with a criticality analysis of inter-structure wire delays and show that for most tra- ditional simple superscalar cores, 2D floorplans are already very efficient at minimizing critical wire delays. For an aggressive wire-constrained clustered superscalar architecture, an exploration of the design space reveals that 3D can yield higher benefit. However, this benefit may be negated by the higher power density and temperature entailed by 3D integration. Overall, we report a negative result and argue against leveraging 3D for higher ILP

1,5-Benzosulfonamide anthracenedione analogues of mitoxantrone as antibacterial and anticancer agents

442-449The new 1,5-disubstituted 9,10 anthraquninone compounds have been synthesized and characterized by FT-IR, 1H and 13C NMR, and mass spectrometry. Mass fragmentation pattern confirms the structure of the synthesized analogues. The synthesized compounds (B1-B5) have been found active against Hela (cervix carcinoma), prostate cancer and breast cancer cell lines in comparison to mitoxantrone. B2 screened out to be best. IC50 value of B2 and mitoxantrone against Hela cell lines have been observed to be 17μg/mL and 2.5μg/mL respectively. DNA intercalation has been proposed as per cell cycle analysis of B2 on Hela cell lines which show major alteration in G0/G1 and S phase. The results are further supported by molecular docking study of (B1-B5) compounds and mitoxantrone with quadruplex terminals i-motif. The compounds have also been evaluated for antibacterial activities

Memory Centric Characterization and Analysis of SPEC CPU2017 Suite

In this paper we provide a comprehensive, memory-centric characterization of the SPEC CPU2017 benchmark suite, using a number of mechanisms including dynamic binary instrumentation, measurements on native hardware using hardware performance counters and OS based tools. We present a number of results including working set sizes, memory capacity consumption and, memory bandwidth utilization of various workloads. Our experiments reveal that the SPEC CPU2017 workloads are surprisingly memory intensive, with approximately 50% of all dynamic instructions being memory intensive ones. We also show that there is a large variation in the memory footprint and bandwidth utilization profiles of the entire suite, with some benchmarks using as much as 16 GB of main memory and up to 2.3 GB/s of memory bandwidth. We also perform instruction execution and distribution analysis of the suite and find that the average instruction count for SPEC CPU2017 workloads is an order of magnitude higher than SPEC CPU2006 ones. In addition, we also find that FP benchmarks of the SPEC 2017 suite have higher compute requirements: on average, FP workloads execute three times the number of compute operations as compared to INT workloads.Comment: 12 pages, 133 figures, A short version of this work has been published at "Proceedings of the 2019 ACM/SPEC International Conference on Performance Engineering